Container shipping terminal with stacked cargo containers, cranes, and docked vessels.

DATAPOINT OF THE WEEK: April new car registrations in Europe totaled 1.15M, surpassing the 1M mark for second straight month. Registrations increased 7.0% Y/Y but declined 27.1% M/M, largely in line with seasonal trends, according to ACEA data. BEVs maintained strong growth in April, reaching 255k registrations, up 38.3% Y/Y, but down 25.8% M/M. BEVs accounted for 22.2% of the market in April, up 4.8 percentage points Y/Y. PHEVs also saw significant Y/Y growth, rising 21%. HEVs increased 12.6% Y/Y but fell 31% M/M. HEVs now account for 36.4% of the market, up 2.3 percentage points Y/Y. ICE registrations declined 15% Y/Y and 23.8% M/M in April, marking its 24th straight month of Y/Y declines.

Headlines:

Auto/Transportation

  • China EV prices reverse higher as lithium, automotive DRAM, and copper costs crush industry margins to a decade low, according to DigiTimes
  • Memory cost spike emerges as biggest 2026 auto pricing pressure, threatening to offset NEV incentives as Tesla retakes global BEV crown, as reported by TrendForce
  • NIO CEO calls China auto market saturated, but plans to stay focused domestically with 5x smart-driving compute spend in 2026 as overseas push stays sidelined
  • Nissan's JATCO scraps UK EV powertrain plant as demand stalls and Nissan trims production footprint, according to Nikkei
  • Trump administration pushes USMCA rewrite lifting NA auto content to 82% with half from US, sidelining Canada, according to Reuters
  • Waymo announced its debut of sixth-gen autonomous stack in Geely-built Zeekr Ojai minivan, opening passenger rides across three US cities
  • Xpeng guides 2Q revenue below expectations as soft China EV demand deepens and 1Q losses widen

Datacenter

  • Dell reports 1Q AI server revenue surpassed PC sales as memory-driven price hikes and supply tightness reshape the mix
  • Iren announced a $1.6B Dell contract for Blackwell systems to fulfill $3.4B Nvidia AI cloud deal
  • Meta is reportedly evaluating cloud computing entry, according to CNBC

Connectivity

  • Aixtron wins multiple G10-AsP MOCVD orders from Lumentum to expand InP laser capacity for 800G and 1.6T AI optical links
  • Marvell lifts long-term outlook as custom silicon ramps past $10B by FY29 on hyperscaler ASIC wins
  • Semtech flags AI networking demand at 3x supply as 1.6T optical shipments to US hyperscaler shift story to capacity execution

Semiconductors

  • AWS announced it has landed a $6B Snowflake AI infrastructure deal as Graviton CPUs expand role in agentic workloads
  • BYD launches in-house smart-driving chip it claims is China's most powerful, deepening silicon self-sufficiency push
  • ByteDance pursues in-house CPUs on parallel Arm and RISC-V tracks as Intel and AMD hike prices up to 35% Q/Q, according to Reuters
  • GlobalWafers announced plans to raise silicon wafer prices in 2H26 with 12-inch capacity is running at full utilization and smaller wafer sizes have visibility extending into 3Q
  • GlobalWafers announced it is rolling out a phased 30%, and an additional +20% GaN capacity expansion as 2026 supply tightens on AI server and robotics demand
  • Infineon sets second 2026 price hike for July 1 as power chip suppliers ride structural AI demand shift, according to TechNews
  • MediaTek backs both TSMC CoWoS and Intel EMIB for custom AI silicon and will allow customers to pick
  • Micron shifts LPDDR4 and DDR4 production to Virginia Fab 6 as Taiwan operations pivot to DDR5 and HBM, says TrendForce
  • Nexperia announces partnership with US foundry Polar Semiconductor to manufacture power MOSFETs, expanding automotive-grade capacity
  • Qualcomm wins ByteDance ASIC supply deal, marking inroad into AI datacenter chips beyond smartphone processors, says Bloomberg
  • Samsung planning to invest $1.5B into first Vietnam chip testing plant targeting DRAM and NAND as AI-driven memory shortage spreads to legacy nodes, according to Reuters
  • Stellantis announced expansion of multi-year deal to deploy Qualcomm Snapdragon Digital Chassis across global portfolio, with aiMotive set to join Qualcomm
  • STMicro has reportedly notified customers of a new round of price increases effective June 28, 2026, covering products not included in earlier 2026 adjustments, according to SemiMedia
  • STMicro announced it has expanded its PowerGaN portfolio with seven new 700V enhancement-mode GaN HEMTs targeting AI servers, robotics, industrial systems, and smart-grid converters
  • TSMC is reportedly preparing up to 15% 3nm price hike in 2H26 with another 5-10% in 2027 as AI and ASIC demand swamp capacity, per Commercial Times
  • TSMC reframes roadmap around power efficiency as A14 targets 30% lower consumption and A13/A12 skip High-NA EUV, according to TrendForce

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Dennis Reed

Dennis Reed

Dennis started in the industry in 2005 at FTN Midwest Research on the technology & semiconductor team. In 2006, he was a founding member of Cleveland Research Company and continued to develop an extensive network of technology industry professionals in the semiconductor, distribution, memory and HDD industries throughout the world. Dennis worked at KeyBanc Capital markets in New York, on teams covering Consumer Staples and Paper & Packing companies. Dennis also brings wide level of experience working in various roles with Travelers Insurance, including Market Research and various product roles supporting business unit growth in targeted end markets. 

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