Vishay PolarPAK® Power MOSFETs
Features
- Leadframe and plastic encapsulation construction
- Provides better die protection and reliability
- Easier manufacturing handling
- Fixed footprint and pad layout independent of die size, ≤ 100 V
- Licensed by multiple sources
- Top (1 ºC/W) and bottom (1 ºC/W) cooling provides dual heat dissipation paths for forced air applications
- Easy to parallel devices, lowering inductance from board layouts
- Low parasitic inductance improves efficiency, especially at higher frequencies
- Double current density (> 60 A) reduces space and cost
- Same footprint area as SO-8
- 0.8 mm profile, less than half of SO-8
Applications
- VRM modules for servers and workstations
- Fixed telecom and data communication systems