Molex NeoPress High-Speed Mezzanine Connector System is an advanced solution designed for space-constrained PCBs, supporting data rates up to 28Gbps. The tunable differential pairs and modular design allow for customization, while the solderless compliant-pin termination simplifies assembly and rework. The NeoPress connector system is built with high-temperature LCP housing, and these operate from -55°C to +85°C, ensuring durability. Typical applications include telecommunications, industrial automation, and medical applications.
Molex NeoPress High-Speed Mezzanine Connector System
Features
- Connectors feature a density of 76 differential pairs/triad per square inch
- Durable housing material
- Ground plate on upper and lower housings
- Hermaphroditic interface
- High-speed triad wafers comprise three pins per differential pair
- Options include four triad configurations, high-speed single-ended traces, low-speed single-ended lines, and power contacts
- Proven Impel pressfit compliant-pin termination design with data rates up to 28Gbps
- Reliable mating interface with 1.50mm wipe
Applications
- Industrial automation
- Controller personality cards
- Medical
- Telecommunication/networking
- Hubs
- NAS towers
- Rack mount servers
- Servers