Molex SW1 Wire-to-Board and Busbar Interconnects
Molex SW1 High-Current Wire-to-Board and Busbar Interconnects include a special positive-locking design for secure mating and COEUR socket technology. This allows for a high-current carrying capability in three sizes: 6mm (120A), 8mm (185A), and 11mm (300A). The SW1 wire-to-board and busbar interconnects have several contact beams optimized for transporting current, resulting in low contact resistance, low voltage drop, and minimal heat generation at the contact interface. These interconnects feature an operating temperature range from -40°C to +125°C and a maximum voltage of 1000V. Typical applications include battery storage systems, factory equipment, and robotics.
Features
- Color-coded receptacle housings
- Compact design
- Design flexibility
- Multiple contact beams with optimal current-carrying capacity
- Positive-locking stainless steel spring clips
- Quick connect or pinch-to-release cable assemblies
- Reliable crimp geometry with high-quality 8-sided crimp profile
Applications
- Energy storage
- Battery storage systems
- Power conditioning equipment
- Industrial automation
- Factory equipment
- Robotics
Technical Specifications
| Parameters | Sizes | ||
|---|---|---|---|
| 6mm | 8mm | 11mm | |
| Maximum contact resistance | 0.25mΩ | ||
| Maximum current | 120A | 185A | 300A |
| Maximum mating force | 50N | 60N | 70N |
| Maximum voltage | 1000V | ||
| Minimum unmating force | 5A | 6A | 7A |
| Operating temperature range | -40°C to +125°C | ||
