Molex SpeedStack Mezzanine Connector System
Molex SpeedStack Mezzanine Connector System offers a high-density, low-profile solution with data rates up to 56Gbps per differential pair, ideal for space-constrained applications. These connectors come with a robust insert-molded wafer design with a protected shrouded housing that provides support to the terminal location to improve electrical balance within the signals for high-density systems. The SpeedStack mezzanine connector systems can operate within the temperature range from -40°C to +105°C with a maximum voltage of 250V AC and a durability of 100 cycles. Typical applications include telecommunications, networking, medical, and consumer.
Features
- 100Ω impedance design
- Edge coupling allows flexible impedance matching
- Ergonomic narrow housing design
- Mated stack heights from 4mm to 10mm with a 0.80mm pitch
- RoHS-compliant and halogen-free
- Robust insert-molded wafer design with protected shrouded housing
- Shielding ground pins improves electrical performance and minimizes crosstalk
- Split-pad PCB design
- Terminal geometry technology is used from the zQSFP high-speed connector system
Applications
- Consumer:
- Camera
- Handheld scanners
- Defense and medical:
- Base stations
- Scanning equipment
- Networking:
- Routers
- Servers
- Storage
- Switch
- Telecommunication:
- Mobile
- Remote radio antennas
Technical Specifications
| Parameters | Values |
|---|---|
| Contact resistance | 10mΩ |
| Dielectric withstanding voltage | 300VAC |
| Insulation resistance | 10MΩ |
| Maximum current | 1A per pin |
| Maximum voltage | 250VAC |
| Operating temperature range | -40°C to +105°C |
