ITT Cannon MDM PCB Micro Connectors
ITT Cannon MDM-PCB Micro Connectors are ruggedized connectors that can withstand extreme temperatures and are engineered for use with flex circuitry, flat cable, printed circuit boards, or multi-layer boards. These connectors are designed to MIL-DTL-83513 specifications and are available in 8 shell sizes with 9 to 100 contacts with coaxial contact arrangements. The MDM-PCB connectors come with condensed straight and 90° right angle terminations and positive coupling with locking hardware. These micro connectors use a standard Cannon MDM metal shell that provides high density and high reliability in board-to-board, board-to-cable, and cable-to-cable applications such as UAVs, soldier modernization, IFE, and cabin systems.
Features
- Condensed PCB right angle board layout for ease of termination
- High-density, high-reliability board-to-board and board-to-cable applications
- Positive coupling with locking hardware
- Qualified to MIL-DTL-83513 specifications
- RoHS and REACH complaint
- Straight and right-angle PCB terminations
Applications
- Aerospace and defense
- Avionics and control systems
- Communications
- IFE and cabin systems
- Smart weapons and ordnance
- Soldier modernization
- UAVs
Technical Specifications
| Parameters | Values |
|---|---|
| Contact material | Gold-plated copper alloy |
| Layouts | 9, 15, 21, 25, 31, 37, 51, and 100 |
| Maximum current rating | 3A |
| Maximum contact resistance | 8mΩ |
| Maximum voltage rating | 600VAC |
Video
This TTI Tech Specs video for ITT Cannon MDM-PCB Micro Connectors showcases ruggedized connectors that can withstand extreme temperatures and are engineered for use with flex circuitry, flat cable, printed circuit boards, or multi-layer boards.
See video transcript below
Video Transcript
In the realm of critical applications, reliability is paramount. Whether ensuring downhole drilling systems remain operational or supporting mission-critical defense applications like missile systems and avionics, ITT Cannon's 200°C and 230°C High Temperature Micro MDM solutions deliver optimal performance when it matters most. Derived from MIL-DTL-83513 specifications, these rugged connectors withstand extreme temperatures and conditions from space to miles beneath the earth's surface. Supporting current ratings up to 3A and 500 mating cycles, they offer various configurations, including standard or low-profile stranded wire, solid wire, solder pot, and board mount PCB.