Amphenol FCI (ACS) DensiStak Board-to-Board Connectors
Amphenol Communications Solutions DensiStak Board-to-Board Connectors are high-density, high-speed connectors equipped with a dual-beam contact system, ensuring dependable performance. DensiStak connectors are engineered with 11 rows and over 1000 high-density pins, supporting high-speed transmission up to PCIe Gen 4 with speeds of up to 16Gb/s. USCAR-2-certified DensiStak connectors come in a compact form factor with a pitch of 0.80mm x 1.25mm, making them space-efficient. These board-to-board connectors feature an operating temperature range from -55°C to +125°C and a minimum insulation resistance 100mΩ. Typical applications include automotive, instrumentation, and telecommunication.
Features
- Adhering to RoHS standards, halogen and lead-free
- Compact and reliable design
- Compliant with USCAR-2 standards
- Complies with health, safety, and environmental regulations
- Contact system with dual beams
- Design featuring an open-pin-field configuration
- High-speed capabilities
- Increased density
- Material with UL94V-0 high-temperature rating
- Offers solutions for connecting chips with varying speed and power requirements
- Soldering tails for surface mount components
Applications
- Automotive:
- Advanced Driver Assistance Systems (ADAS)
- Instrumentation:
- Industrial
- Sensing and instrumentation
- Telecommunication:
- Artificial Intelligence (AI)
- Server
- Storage
Technical Specifications
| Parameters | Values |
|---|---|
| Current rating | 0.8A/contact 4A/shield spring |
| Data rate | Up to 16Gb/s |
| Minimum insulation resistance | 100mΩ |
| Operating temperature range | -55°C to +125°C |
| Voltage rating | 100VAC/VDC |
- Amphenol Communications Solutions DensiStak Board-to-Board Connectors Datasheet & Specifications (PDF)
- Amphenol Communications Solutions DensiStak Board-to-Board Product Presentation (PDF)
- Search All Amphenol Communications Solutions Board-to-Board & Mezzanine Connectors
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