TE Connectivity Space Interconnect Dynamics

The following TE Connectivity Whitepaper explains the technicalities in space exploration by developing robust interconnect solutions to address key challenges. The products meet stringent requirements for size, weight, vibration, temperature extremes, outgassing, ESD, electromagnetic permeability, and corrosion control, enabling successful deployment in the dynamic landscape of space exploration. The incorporation of commercial-off-the-shelf (COTS) components under conservative design rules offers flexibility for missions with limited life cycles.

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