TE Connectivity Z-PACK TinMan Backplane Connectors are a cost-effective solution for high-density, high-performance backplane interconnect systems. The Z-PACK TinMan connectors have a design that follows proven industry backplane convention by offering a fully protected right-angle receptacle for use on daughtercards where handing damage can be a concern when mating to a vertical male header. The connectors permit field repairability at either the module or single-pin levels.
TE Connectivity Z-PACK TinMan High Density Backplane Connectors
Features
- 85Ω impedance for differential pair configuration
- Density up to 14 high-speed differential pairs per cm (80 DP per inch)
- Meets industry standard reliability requirements
- Modular system offered in various column versions
- Modular system with 3, 4, 5, and 6 pairs per column, fitting 16.25mm (.625"), 20.32mm (0.8") and 25.4mm (1") slot-pitch respectively
- Performance up to 12.5Gbps
- Reliable, redundant contact design on every signal contact
- Sequencing for ground and signal contacts
Applications
- Optical transport
- Servers
- Switches and routers