TE Connectivity offers customized antenna solutions. The wireless industry demands increased complexity and miniaturization of antennas, combined with a need to integrate a multi-radio environment into one component. We offer a wide array of customized antenna solutions to accommodate the mechanical constraints of your application, design and manufacture antennas that comply with the most stringent operating requirements, and are a pioneer of customized embedded antenna solutions. Let us design the antenna you have been looking for.
TE Connectivity Customized Antenna Solutions
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- 877-645-4884
- sales@ttiinc.com
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Features
- MID Technology
- Laser Direct Structuring (LDS)
- Two-Shot (2k) Molding
- Printed Antennas
- Speaker Acoustic Module (SAM)
Resources
- Automotive connectivity
- Consumer electronics
- Industrial
- IoT devices
- Medical devices
- Smart grid and energy management
Video
This TTI Tech Specs video for TE Connectivity Custom Antennas explains TE Connectivity offers custom antennas using MID technology and either laser direct structuring or two-shot molding. MIDs can integrated multiple electrical and mechanical functions into almost any shape, enabling new functionality and facilitating miniaturization.
See video transcript below
Video Transcript
While the world goes wireless, designers have turned to PCB and chip antennas believing that the performance penalty was the only way to meet space constraints. TE Connectivity offers custom antennas using MID technology and either laser direct structuring or two-shot molding. MIDs can integrated multiple electrical and mechanical functions into almost any shape, enabling new functionality and facilitating miniaturization. Both techniques allow for 3D design and routing, and for the antenna to be placed on design structures with more space for a larger antenna.
The result is improved antenna performance for increased bandwidth and efficiency. LDS MID antennas allow for improved time to market and cost savings. Two shot MID technology can integrate multiple functions in one component and uses the fewest manufacturing steps and processes. It offers higher yields and improved scalability compared to alternative technologies.