TE Connectivity mPGA Sockets (micro Pin Grid Array) and PGA Sockets are designed for various Intel and AMD microprocessor packages for notebook PCs, desktop PCs and servers. These sockets provide a ZIF (Zero Insertion Force) PGA interface to the microprocessor PGA package and are solder ball SMT (Surface Mount) attach to the PCB. The mPGA abd PGA sockets are available in arrays up to 959 positions with single lever, screw driver, and hex wrench actuation methods. These sockets are primarily employed for microprocessor package test applications using through-hole solder attachment to the PCB design. The contacts are screw-machine outer sleeves with either stamped and formed or drawn inner contacts.
TE Connectivity mPGA/PGA ZIF Sockets
Features
- 1.27mm x 2.54mm contact spacing
- 989 array positions
- PGA package
- Stamped and formed metal contacts
- Socket arrays up to 462 positions
- Surface-mount technology
- Through-hole solder
- Zero Insertion Force
Applications
- Notebook PCs
- Desktop PCs
- Servers