TE Connectivity Land Grid Array (LGA) Sockets are developed for Intel and AMD-based LGA microprocessor packages that range in size up to 1200+ positions. These sockets provide a compressive electrical interface to the microprocessor package and are solder ball SMT (Surface Mount) attached to the PCB. The stainless steel load plate provides a reliable interconnection to the microprocessor package with a single lever handle for package actuation. The contact tip geometry is optimized to reduce the risk of contact damage during handling and package installation.
TE Connectivity LGA Sockets
Features
- 1.1mm x 1.1mm and 1.17mm x 1.09mm contact spacing
- For Intel and AMD CPU PGA packages
- LGA compressive interface to package, surface mount solderball attach to PCB
- Socket arrays up to 1,200+ positions
- Stamped and formed metal contacts
Applications
- Aerospace flight controls and landing gear
- Data center servers
- Data center storage systems
- Data center switching and routers