TE Connectivity OSP Miniature Modular Blind Mate Connectors are semi-rigid connectors that meet high-performance requirements for microwave multiple interconnects. These connectors are available in bulkhead or panel mount design and in direct solder and solderless compression crimp attachment. The connectors are easy to assemble, highly reliable, and have an operating temperature range from -65°C to 125°C.
TE Connectivity Blind Mate Connectors 2.4/2.8/3.5
Features
- Available in Module to module, module-to-motherboard, fixed and float mount
- Interface designed for multiple interconnects
- Suitable for high-performance microwave system requirements
- Suited for flexible and semi-rigid cables
Applications
- Medical equipment
- Infotainment systems
- Wireless base station infrastructure equipment
- Installation and maintenance of energy systems, including energy storage, power plants, and electric power transmission systems
- Consumer appliances