TE Connectivity MULTIGIG RT Connectors offers flexibility and customization in backplane interconnect solutions. MULTIGIG RT pinless interconnect family, based on printed circuit technology, consists of modular components that can be configured in various combinations. These connectors provide the required density, data throughput, and signal integrity for a wide range of applications. The use of printed circuit wafers enables cost-effective sequencing and electrical customization, with wafers tailored for either differential or single-ended performance. Impedance, propagation delay, and crosstalk can be adjusted according to customer specifications. These scalable board-to-backplane connector family features a robust, pinless design that eliminates the pin field on backplane boards, reducing the risk of field failure in card cage systems. The MULTIGIG RT connector family is designed for 20.30mm (0.8inch) or 25.40mm (1.0inch) card pitch configurations.
TE Connectivity MULTIGIG RT Connectors
Features
- 3 levels of signal contact sequencing
- Compatible with 2mm HM equipment practices
- Compatible with both 20.30mm (0.8inch) and 25.40mm (1.0inch) card pitch systems
- Customizable impedance-matched printed circuit wafer interface
- Durability rated for 200 cycles
- Excellent crosstalk performance
- Fully compatible with MP-based fiber optic array interconnects
- Modular style available
- Optimized footprints for improved signal integrity and board design simplicity
- Suitable for stacking applications
- Uses a 0.56mm (0.022inch) diameter via for backplane connectors to reduce board fabrication expense
Applications
- High end servers
- High speed custom platforms
- Mass data storage
- Midrange servers
- Rugged and mission-critical applications
- Telecommunications equipment
- Aggregation switches
- Metro optical networking equipment
- SONET switched platforms
- Aggregation switches