TDK TFSx Series RF Couplers utilize thin-film process technology originally developed for HDD R/W heads, ensuring precise patterning and miniaturization. This technology, now applied to RF components such as filters, diplexers, couplers, and baluns, meets the market demand for smaller, higher performing products. TFSx couplers boast tight specification tolerances and reduced lot-to-lot variations, ensuring consistent performance. These TSFx couplers offer compact, low-profile RF components with outstanding performance and are ideal for cellular/LTE applications in smartphones and tablets, as well as WLAN, BT, and GPS technologies.
TDK TFSx RF Couplers
Features
- Comes in LPF, BPF, HPF, Coupler, and Balun configurations
- Compact and low-profile design using thin film technology
- Highly reliable with top-tier performance
- Minimal signal loss
- Precise tolerances and consistent performance from batch to batch
- Small form factor suitable for front end module applications
- Stable characteristics over time
Applications
- Bluetooth
- LTE
- Navigation
- WiMAX
- Wireless LAN