TDK’s HHM1xxx series, multilayer Low-Temperature Co-fired Ceramic (LTCC) baluns, convert an unbalanced signal into a balanced signal or vice versa. The baluns can also be used for impedance matching to improve electronic circuit efficiency. TDK’s baluns are available in a wide range of configurations with frequencies ranging from 673MHz to 5.95GHz and dimensions ranging from 0.6 x 0.5mm to 2.0 x 1.2mm. They are ideal for use in WLAN, Bluetooth, LTE, and GSM applications.
TDK Baluns
Features
- Case Size: EIA 0202 ～ EIA 0805
- Frequencies: 673MHz ～ 5.95GHz
- Termination Type: STD or LGA
- Operating Temperature: -40°C ～ +85°C
- LTCC based design
- Wide Frequency band products available
- Targeted RF band specific, high performance products available
- Compact and high performance
- Standard case sizes and pin-outs for multi-band PCB designs
- Available in 50:50(ohms), 75:50, 100:50, and 200:50 as well as chipset specific configurations
Applications
- LTE/WCDMA/CDMA
- GSM
- Bluetooth
- Wireless LAN
- ZigBee
- WiMAX
- Near-Field Communication
- UWB
Resources
- Datasheet (PDF)