TDK C Series Conductive Epoxy MLCCs offer a conductive glue-mounted alternative to solder mounting, that provides more flexibility during expansion and contraction periods, as thermal expansion differences are reduced without solder attachment. The C series conductive epoxy MLCCs feature AgPdCu termination for conductive glue mounting. These conductive epoxy MLCCs are used in applications that cannot be subjected to the heat of the solder paste mounting process, such as LCD panels, organic EL and LED displays, and CCD devices, which are particularly sensitive to high temperatures.
TDK C Series Conductive Epoxy MLCCs
Features
- AgPdCu termination utilized for conductive glue mounting
- Compliant with AEC Q-200 standards
- Compliant with RoHS, WEE, and REACH regulations
- Enhanced mechanical and thermal strength when employed with conductive glue
- Minimizes the potential for silver migration
Applications
- Anti-Lock breaking system
- Applications requiring a conductive glue mounting method
- Automotive power train
- Charge-coupled devices
- Engine sensor module
- LCD panel
- Organic EL and LED displays
- Transmission control