Smiths Interconnect / Molex C153 high-density PCB signal connectors utilize Hypertac® hyperboloid contact technology to deliver exceptional reliability in harsh and demanding environments. Designed for high mating cycles with low contact force and minimal resistance, they ensure stable electrical and mechanical performance. The hyperbolic wire geometry provides multiple linear contact paths around the pin, enhancing signal integrity for critical high-reliability applications.
Smiths Interconnect C153 High Density PCB Signal Connector
Features
• Offset-grid contacts layout, two contact rows within dielectric connector body
• 1.905mm center-to-center contact spacing in each row and 1.651 row-to-row spacing
• 0.5mm nominal pin DIA contact size; 57 contact positions; dip solder
• SMT soldering or wored contact termination types
• High contact density and durability, low profile and light weight. High shock and vibration proof (no micro interruptions - test: 2ns)
• Conforms to MIL-DTL-55302
Applications
• Commercial aviation
• Defense