Smiths Interconnect / Molex C150 high-density PCB connectors feature advanced Hypertac® hyperboloid contact technology for superior reliability, low contact resistance, and high mating cycles in demanding environments. With an eight-row, offset-grid layout and up to 372 positions, they offer 2.54mm spacing and SMT or dip solder terminations. Designed for high shock and vibration resistance, they meet MIL-DTL-55302 standards for aerospace and defense applications.
Smiths Interconnect C150 High Density PCB Connector
Features
• Offset-grid contact layout
• Eight contact rows witin dielectric connector body
• 2.54mm center-to-center contact spacing in each row and 1.27 row-to-row spacing
• 0.5mm nominal pin DIA contact size; 304,372 contact positions; dip solder and SMT soldering contact termination types in PPS solida body
• High contact density, high shock and ibration proof (no micro interruptions - test: 2ns)
• Conforms to MIL-DTL-55302
Applications
• Commercial aviation
• Defense