Smiths Interconnect / Molex MLPI Series interposers are spring-loaded, microminiature low-profile solutions designed for high-performance board-to-board stacking in space- and height-constrained applications. Available in 30 to 120 positions with 1mm pitch and 4mm or 6mm stack heights, they support DC, RF, and digital signals in a single platform without a mating connector, delivering high-density, reliable signal integrity for demanding environments.
Smiths Interconnect Microminiature Low Profile Interposer (MLPI Series)
Features
• Spring loaded microminiature low profile interposers designed for demanding applications where space and height are limited
• Available in 30, 60, 90 and 120 positions with 1 mm pitch as standard and with 4 mm and 6 mm board to board height options
• No appreciable contact resistance degradation under highly accelerated lifetime test conditions
• Low electrical contact resistance variation under extreme shock and vibration conditions
• Qualification inspection according to MIL-DTL-55302
• ROHS compliant
Applications
• Commercial aviation
• Defense
• Oil & Gas
• Space