Smiths Interconnect HDLP Series Signal Connectors

Smiths Interconnect / Molex HDLP Series Signal Connectors are designed for compact and lightweight board-to-board connections. These connectors employ Hypertac Hyperboloid technology to ensure low mating force, stable contact resistance, and strong resistance to fretting corrosion. The HDLP connectors offer a minimum durability of 2000 mating cycles and operate within a temperature range from -55°C to +125°C. These connectors are suitable for use in applications with limited space and high-reliability requirements, such as in the aerospace and defense industries.

Features

• Beryllium copper socket wire material
• Copper alloy contact material
• Encapsulated contacts
• Fluorosilicone interfacial seal material
• Liquid Crystal Polymer (LCP) insulator material
• Low contact resistance
• Low mating force
• Optional conformal coating
• PCB options
• Stainless steel guide material

Applications

• Cameras and displays
• Communication panels
• Industrial equipment
• Missile guidance systems
• Rugged computer systems

Technical Specifications