Smiths Interconnect / Molex CSD high-density PCB connectors feature a four-row, offset-grid contact layout designed for space and high-reliability applications, conforming to ESA specifications. With 1.905mm spacing, 0.6mm pin size, and 42 to 316 positions, they support DIP and SMT terminations while delivering low mating force, high contact density, and resistance to shock and vibration for aerospace and defense environments.
Smiths Interconnect CSD High Density Signal, PCB Connectors
Features
• Offset-grid contact layout
• Four contact rows within dielectric connector body
• 1.905 mm center-to-center contact spacing in each row and 1.905 row-to-row spacing
• 0.6 mm nominal pin DIA contact size; 42 to 316 contact positions
• Dip solder and SMT soldering contact termination types
• High contact density, low connector weight, lowmating force. High shock and vibration proof (no micro interruptions - test: 2ns)
• Conform to ESA specification.
Applications
• Commercial aviation
• Defense
• Space