Smiths Interconnect / Molex CEA/ST 1065 data transfer connectors are designed for industrial applications, featuring 1.5mm pin contacts with 3, 5, and 9 position options. With an offset grid layout and 5.08mm spacing, they support one or two contact rows and multiple termination styles including solder and crimp. Built for reliable performance, they provide flexible, durable connectivity for industrial data transfer systems.
Smiths Interconnect CEA/ST 1065 Data Transfer Connector
Features
• Offset grid contact layout, one or two contact rows within dielectric connector body
• 5.08mm center-to-center contact spacing in each row and 5.08mm row-to-row spacing if applicable
• 1.5mm nominal pin DIA contact size; 3,5 and 9 contact positions
• Hand solder, dip solder and crimp termination styles
Applications
- Industrial