Samtec
Resources

Reliable connectivity for drones & UAVs in defense and commercial sectors, delivering lightweight, high-performance solutions for every mission.

Samtec Protecting Interconnects from Shock and Failure explains creepage and clearance using CTI to reduce arcing, shock, and failures in power-dense systems.

Samtec Controlling Impedance White Paper details how Samtec designs connectors and cables to manage impedance, minimize signal loss, and ensure high RF performance integrity.

Samtec brochure on EV charging and EVSE outlines interconnect solutions, key applications, covering onboard chargers, AC/DC charging, V2G systems, and supporting infrastructure.

Samtec provides a cheat sheet covering a variety of series of discrete wire solutions.

Samtec's RF Interconnect Solutions Test & Measurement white paper addresses how advanced interconnects assist modern RF testing demands.

Samtec’s 1.00 mm Micro Mate cable system offers compact, flexible discrete wire for board, cable, and panel connections with up to 40 pins.

Samtec Enabling Industrial Automation White Paper highlights rugged connectors and board stackers that support high-cycle, compact, and vibration-prone industrial systems.

Samtec guide for high-performance interconnect solutions -- AI and ML applications, focusing on speed, density, signal integrity, and power efficiency.

Samtec handbook guides on selecting interconnects for high-speed systems, focusing on signal integrity essentials, analysis, and design best practices.

Samtec chart for drone and UAV applications -- highlighting size, weight, and power (SWaP) specs to help select compact, lightweight, and efficient interconnects.

Samtec Product Testing Guide explains the different testing processes that all Samtec products undergo.

Samtec’s ITAR flyer details secure U.S. manufacturing and restricted access, supporting defense and aerospace with the MAP series’ optics, cables, arrays, RF, and interfaces.

Samtec LEO Satellites Brochure lists connectors and cables for compact, lightweight, high-speed applications, including optics, board-to-board, RF, and tested rugged solutions.

Explore the Samtec EV Charging Solutions Brochure, highlighting robust connectivity options for electric vehicle charging, designed for durability in harsh environments.

Samtec SOSA Aligned Interconnect Solutions support defense sensor systems with high-density connectors, VNX/OpenVPX standards, and rugged, SWaP-optimized designs.

Samtec’s extensive range of tin-lead-plated connectors are designed for defense and aerospace use. They offer reliability, easy repair, and whisker-free performance.

Samtec's Embedded Vision products offer high-integrity, compact, rugged connectors like optical, RF, 12G-SDI, and CoaXPress for harsh, high-performance environments.

Samtec Robotics Solutions Guide offers innovative interconnect systems designed for robotics applications, ensuring high reliability, durability, and optimized performance.

Samtec Industrial Automation Brochure details rugged interconnects, high-power systems, and testing for extreme conditions. These support flexible, high-density designs.

Samtec interconnect solutions help meet data communication, smart sensor, and scalability needs of the industrial IoT applications.

Discover Samtec's comprehensive range of high-performance interconnect solutions for defense and aerospace, designed for reliability and durability in extreme environments.

Samtec Phased Array Systems deliver cutting-edge connectivity for military and aerospace applications, featuring high-speed interconnects and rigorous testing for reliability.

Samtec's line card covers the six solution blocks that are designed to support interconnectivity needs and are typically used in industrial, medical, and datacom applications.

Samtec Full Channel Interconnect Solutions Brochure offers comprehensive silicon-to-silicon and core board-to-board solutions for the electronics industry. 

Samtec provides various Sudden Service solutions for standard and customer-specific automotive designs with high performance, density, and reliability.