Nexperia X2SON Leadless Packages ensure pad pitch remains 0.4mm or higher, minimizing the need for step-down masks while offering the shortest footprint for logic operations. X2SON leadless packages come in 4, 5, 6, or 8 pins and are offered in low-power AUP, AXP, LV & LVC technology families, encompassing more than one hundred logic functions. The X2SON leadless packages provide improved durability and a high contact area-to-chip ratio. These X2SON packages find uses in mobile devices, portable computing, consumer electronics, and space-constrained applications.
Nexperia X2SON Leadless Packages
Features
- Easy to assemble with a lead pitch of ≥0.4mm
- Increased durability and a high contact area-to-chip ratio
- Low width (0.8mm) and low-profile height (0.35mm)
- Miniaturization and simpler positioning
- NiPdAu leadframe finish with RoHS and dark-green compliance
- Smaller footprint compared to alternatives for GF and GN packages
Applications
- Consumer electronics
- IoT and wearables
- Mobile devices
- Portable computing
- Space constrained applications