Molex C-Grid/SL Series Modular Interconnect System

Molex SL (Stackable Linear) Modular Interconnect System provides flexible, single-row connectivity for wire-to-wire and wire-to-board applications. The system includes low-profile latching headers (vertical and right-angle), stackable housings for crimp terminals, pre-assembled pin and receptacle connectors for IDT termination (discrete wire or ribbon cable) and piercing crimp termination (FFC/FPC), and latching interim clips for larger assemblies. Molex SL connectors are designed for low-power signal applications, and the panel mounts facilitate modular wire-to-wire remote connections.

Molex C-Grid Modular Interconnect System is a robust, dual-row board-to-board solution. The system offers a comprehensive range of headers (vertical, right-angle, breakaway, shrouded, dual-body, SMT, and press-fit) and receptacles (vertical, right-angle, and SMT), and a 2-circuit shunt. The C-Grid modular interconnect system is compatible with both SL and KK products. The C-Grid/SL series modular system operates within a temperature range from -40°C to +105°C and is typically used in automotive, computer, and telecom applications.

Features

• Available in through hole and SMT configurations
• C-Grid headers are compatible with SL housings
• C-Grid headers mate with SL housings to offer secure wire to-board connection
• Delivers high-temperature assembly processing
• Positive latching system 
• Reflow capable headers
• Three termination methods are available

Applications

• Automotive
• Business machines
• Computers
• Heating and air conditioning equipment
• Large industrial equipment
• Measuring analyzing equipment
• Medical instrumentation
• Telecom

Technical Specifications