This TTI Tech Specs video for Molex PowerPlane Busbar Power Connectors explains that they are available with various configurations and features to provide high current performance in consumer, data center, networking, telecom, and many other applications.
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Video Transcript
Molex PowerPlane Busbar Power Connectors are available with various configurations and features to provide high current performance in consumer, data center, networking, telecom, and many other applications.
Molex PowerPlane Busbar Power Connectors use a high-conductivity copper alloy that enables low voltage drop to minimize heat generation. The contacts are silver plated and they have multiple independent points of contact to enable high reliability and enhanced performance, with 40% more points of contact than competitive products.
Right angle connectors are available with solder tab or screw mount attachments, and vertical assemblies come in screw mount attachments — providing designers a scalable solution based on the same separable interface.
The innovative contact technology on the connectors allows for mating with 3.00- and 3.18-millimeter-thick busbars while offering ± (plus-minus) 1.00 millimeter gatherability.
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