Molex PowerPlane Busbar Power Connectors

Molex PowerPlane Bus Bar Power Connectors deliver high-current performance along with various configurations and feature options. PowerPlane Busbar Power Connectors deliver ±1.00mm alignment to help ensure correct mating and help prevent potential damage. The components are applicable for a wide range of power distribution applications.

Features

  • High-conductivity copper alloy
  • Float-mount design available
  • Dimensionally compatible with competitors’ connectors
  • Silver plating for lower resistance
  • Low-voltage drop
  • One part number mates with 3.00- and 3.18mm-thick busbar tabs

Applications

  • Consumer
    • Power connections
  • Data Center Solutions
    • Routers
  • Networking
    • Network interfaces
    • Networking equipment
    • Power supplies
    • Rack-mount servers
  • Telecommunications
    • Base stations
    • Routers
    • Switches
  • Industrial Automation
    • Automobile construction equipment
  • Commercial Vehicle
  • Energy Storage Systems
    • Electrical switch panels

Video

This TTI Tech Specs video for Molex PowerPlane Busbar Power Connectors explains that they are available with various configurations and features to provide high current performance in consumer, data center, networking, telecom, and many other applications.

See video transcript below

Video Transcript

Molex PowerPlane Busbar Power Connectors are available with various configurations and features to provide high current performance in consumer, data center, networking, telecom, and many other applications.

Molex PowerPlane Busbar Power Connectors use a high-conductivity copper alloy that enables low voltage drop to minimize heat generation. The contacts are silver plated and they have multiple independent points of contact to enable high reliability and enhanced performance, with 40% more points of contact than competitive products.

Right angle connectors are available with solder tab or screw mount attachments, and vertical assemblies come in screw mount attachments — providing designers a scalable solution based on the same separable interface.

The innovative contact technology on the connectors allows for mating with 3.00- and 3.18-millimeter-thick busbars while offering ± (plus-minus) 1.00 millimeter gatherability. 

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