Molex UltraWize Power Connectors and Cables Assemblies
Molex UltraWize Wire-to-Board, High Current Power Connectors and Cable Assemblies provide efficient, space saving power distribution for demanding data center environments. These connectors feature a compact cable side exit design, secure locking, reduced PCB footprint, and reliable high current power delivery. The UltraWize connectors and cable assemblies operate within a temperature range from -40°C to +125°C and have a contact resistance of 0.4mΩ. These connectors and cable assemblies have a dielectric withstand voltage of 125Vac and a maximum current of 170A. Typical applications include power for data centers, servers (GPU), and switches.
Features
- Minimizes PCB footprint
- Minimizes stack height
- Reduces mis-mating
- Reduces processing costs
- RoHS compliant
- Secures connector mating
Applications
- Power for data center:
- Servers (GPU)
- Switches
Technical Specifications
| Parameters | Values |
|---|---|
| Contact Resistance | 0.4mΩ |
| Dielectric Withstanding Voltage | 125Vac |
| Insulation Resistance | 500Vdc |
| Maximum Current | 170A |
| Maximum Voltage | 125V |
| Operating Temperature Range | -40°C to +125°C |
Video
This TTI Tech Specs video for Molex UltraWize High-Current Power Connectors and Cable Assemblies explains how these products provide efficient, space-saving power distribution while reducing contact resistance and heat generation. These products support power distribution in data center servers (GPU) and switches.
See video transcript below
Video Transcript
Last time I traveled I jammed my suitcase full and sat on it so I could zip it up, then I realized I forgot my toiletry bag and had to repack the whole suitcase to fit that in. That’s oddly similar to my last design, a crowded PCB that I thought was fine until I had to account for the power cable bend radius. The easy fix was to switch to Molex UltraWize high-current power connectors and cable assemblies. They’re rated for up to 170A and 125V and made for tight spaces with a cable side-exit design that eliminates bend-radius accommodation. They leverage Molex COEUR socket technology for a large conductive surface area, delivering a maximum contact resistance of 0.4mΩ to reduce voltage drop and heat generation. SMT headers are reflow-capable and have locating pegs for easy assembly, while mechanical keying eliminates mismating and staggered pins reduce PCB footprint.
