Molex Sentrality High-Current Interconnect System
Molex Sentrality High-Current Interconnect System offers exceptional design flexibility and high electrical performance for various applications. These systems feature a compact conical socket design, and it supports co-planar, offset-planar, and reverse-planar mating configurations, ensuring optimal alignment and reduced tolerance issues. The Sentrality interconnect system offers a maximum voltage rating of 1000V, a maximum current rating of 350A, and operates within a temperature range from -40°C to +125°C. The Molex Sentrality 3.40mm Right-Angle Connectors are RoHS-compliant. Applications include data centers, telecommunications or networking industries, and industrial automation.
Features
- Allows radial socket float for alignment
- Compact conical socket design
- Enables various planar mating types
- Ensures low contact resistance
- Fits manual or automated placement
- Offers flexible pin-to-substrate options
- Permits custom pin length settings
- Polarizes connectors via tail patterns
- Self-aligning sockets with wave springs
- SMT pins with caps packed in trays
- SMT sockets with caps in tape-and-reel
- Supports wave and reflow soldering
Applications
- Data centers:
- Data storage units
- Enterprise switches
- Environmental control equipment
- Power Distribution Units (PDUs)
- Power shelves
- Servers
- Uninterruptible power supplies
- Industrial automation:
- AC-to-DC rectifiers
- Battery charging stations
- DC-to-AC inverters
- Robotics
- Telecommunication/networking:
- Data storage units
- Digital cross-connect switches
- Network routers
- Servers
- Uninterruptible power supplies
Technical Specifications
| Parameters | Values |
|---|---|
| Maximum Voltage | 1000V |
| Maximum Current Range | 75A to 350A |
| Maximum Contact Resistance Range | 0.20mΩ to 0.40mΩ |
| Minimum Durability | 200 mating cycles |
| Operating Temperature Range | -40°C to +125°C |
Video
This TTI tech specs video for Molex Sentrality High-Current Pin and Socket Interconnect System explains that they offer high-current board-to-board, busbar-to-board, and busbar-to-busbar connectors and provide a ±1.00mm radial self-alignment to overcome tolerance stack-up issues.
See video transcript below
Video Transcript
Imagine this you need to connect two different boards together via a stack, and you need to share 350A at 600V with multiple mating cycles and alignment pins. Not your typical application, but the Molex Sentrality High-Current Pin and Socket Interconnect System isn’t typical. These connectors are compact and utilize a wide capture area, giving them a 1mm self-alignment capability. They can handle currents up to 350A, and a maximum contact resistance of 0.4mΩ significantly reduces energy loss. They’re offered in pin sizes up to 11mm for the toughest challenges, and all connectors support a minimum of 200 mating cycles. That way you can take things apart and put them back together all you want without affecting the performance of these connectors.
