Molex Mirror Mezz and Mirror Mezz Pro Connectors

Molex Mirror Mezz Connectors feature footprint-compatible hermaphroditic connectors with stackable mating. The Mirror Mezz connectors support data speeds of up to 56Gbps per differential pair for networking, telecommunications, and other applications. These connectors exhibit a stitched Ball Grid Array (BGA) design, which reduces lead times and offers more cost savings than insert-molded BGA attachments. The Mezz connectors come with a robust shrouded housing design that encapsulates the pin field, protecting the pins and offering blind-mate guidance to eliminate any possibility of mismating.

The Mirror Mezz 15x11 OCP Connectors come with stackable mating that supports data speeds up to 112Gbps per differential pair for telecommunications, networking, and other applications. The 15x11 OCP connectors feature wide ground pins that can balance the electrical field and shield the differential pair from surrounding transmission lines.

The Mirror Mezz Pro Connectors have stitched contacts that provide lower costs and are more customizable than insert molding. These connectors are BGA attached and have consistent ball profiles. These connectors are typically used in servers, networking, storage, and infrastructure.

Features

Mirror Mezz 15x11 OCP Connectors

  • 112Gbps data speeds
  • Flex cable links for Mezz
  • Intricately designed terminal structure
  • Mates with 2.5mm and 5.5mm height connectors
  • Robust shrouded housing design
  • Stitched BGA design
  • Wider ground pins

Mirror Mezz Connectors

  • 2 electrically tuned signal contacts
  • 56Gbps data speeds
  • Contact beam structure of a mated combination
  • Footprint-compatible hermaphroditic connectors
  • High-performance copper alloy contact
  • High-temperature thermoplastic housing
  • Open pin field rows
  • Selective gold plating

Mirror Mezz Pro Connectors

  • BGA attached and consistent ball profile
  • Contact differences between rows; paddles have bend direction to contact alternates
  • Stitched contacts for lower cost and improved customizability
  • Stubless contact interface

Applications

  • Data/computing
    • Networking
    • Server
    • Storage
  • Telecommunications
    • Infrastructure
    • Networking

Technical Specifications

Parameters Values
Dielectric Withstanding Voltage 500Vdc
Impedance Mirror Mezz 92Ω
Mirror Mezz Pro 90Ω
Insulation Resistance 1000MΩ
Maximum Current 1A per contact
Maximum Durability 100 cycles
Maximum Voltage 30Vac 
Operating Temperature Range -55°C to +105°C