Molex GbX I-Trac Backplane Connector System
Molex GbX I-Trac Backplane Connector System provides impedance control, reduced crosstalk, and support for power modules capable of carrying over 250A per linear inch. The open pin-field design allows placement of differential pairs, low-speed signals, power, and ground contacts in any configuration. The GbX I-Trac backplane connector system supports quad trace routing to help reduce PCB layer counts, with additional reduction possible through orthogonal routing. These devices operate within a temperature range from -55°C to +85°C, offer a minimum insulation resistance of 1000MΩ, and are rated for 200 mating cycles in applications such as servers, storage, networking, and telecommunications.
Features
- 12.5Gbps data rate support
- 69 differential pairs per inch with open-pin field design
- Broadside-coupled system with skew equalization
- Dual-contact bifurcated beams for reliability
- Integrated mating guidance
- Quad PCB routing lowers layer count and cost
- Standard and orthogonal connections with same parts
Applications
- Data networking equipment
- Servers
- Storage systems
- Defense/aerospace equipment
- Medical equipment
- Telecommunication equipment
- Central office, cellular infrastructure, and multi-platform service (DSL, cable data)
- Hubs, switches, and routers
Technical Specifications
| Parameters | Values |
|---|---|
| Dielectric Withstanding Voltage | 750Vrms |
| Maximum Contact to Plated Through-hole Resistance | 1mΩ |
| Maximum Contact Insertion Force | 35.6N per contact |
| Minimum Insulation Resistance | 1000MΩ |
| Signal Contact Current Rating | 1A |
| Operating Temperature Range | -55°C to +85°C |
