Molex EdgeLine High-Speed Edge Card Connectors

Molex EdgeLine High-Speed Edge Card Connectors support data rates up to 25 Gbps and are available in multiple orientations and PCB thicknesses that can be used in high-signal transmissions and high-density signal applications. These EdgeLine High-Speed Connectors have a thickness of 1.57mm to 3.18mm of multiple PCB and accommodate a variety of PCB thicknesses on complex product designs. The High-Speed Edge Card Connectors will optimize performance with dedicated differential pairs or provide the maximum flexibility of an open array, and also provide enhanced airflow and thermal management. Typical applications of EdgeLine High-Speed Edge Card Connectors are listed as computing systems, connectivity, PCIe, signal, storage systems, SATA, and SAS.

Features

• Common (singulated) ground:
  
  • Optimizes connector performance with dedicated differential pairs, or provides the maximum flexibility of an open array
• High-speed differential contact design:
  • Provides excellent signal integrity; performance up to 25 Gbps, depending upon the application
• Keying and locking features available (0.80mm pitch CoEdge connectors only)
  
• Low profiles: CoPlanar connector 6.44mm above PCB; CoEdge connector 3.50mm above and below PCB
• Multiple circuit sizes are available
  
• Multiple PCB thicknesses (1.57mm to 3.18mm):
  • Accommodates a variety of PCB thicknesses on complex product designs
• Press-fit, compliant-pin terminal options

Applications

• Industrial:
  • Connectivity
  • Signal
• MIL/Aerospace:
  • C4ISR
  • Computing systems
• Networking:
  • Computing systems
  • PCIe
  • SAS
  • SATA
  • Storage systems
• Telecommunications:
  • Storage

Technical Specifications