Molex ISI BGA Reballing and IC Adapter Technology
Custom Compatibility Solutions for Mil-Aero and Hi-Rel Applications
Molex ISI BGA Reballing and IC Adapter Technology
TTI and Molex come together to deliver an enhanced supply chain process with ISI BGA Reballing and IC Adapter Technology. ISI’s reballing process has been audited and approved by several Tier 1 defense suppliers and is the ideal solution for compatibility challenges in military, aerospace, and Hi-Rel applications. The IC Adapter Technology allows customers to convert single or multiple components to virtually any footprint, solving IC obsolescence issues, simplifying designs and avoiding costly redesigns.
- Advanced Packaging Solutions
- Physical Footprint and Electrical Compatibility
- Streamlined Supply Chain Solution
BGA Reballing
Most semiconductor suppliers have converted to lead-free packaging creating reliability and compatibility dilemmas for military, aerospace and Hi-Rel applications. ISI’s process of BGA reballing involves the removal of lead-free (RoHS) solder balls then attaching leaded high reliability Sn63Pb37 and other special solder ball alloys. ISI’s Reballing process has been audited and approved for production by several Tier 1 defense suppliers.
ISI’s 10-Step Certified Reballing Conversion Process
Step: 1 – Incoming Inspection Procedures per Quality Assurance Procedures (QAP)
Step: 2 – Moisture Sensitivity Level (MSL) Requirements are Observed and Followed
Step: 3 – Deballing Process is Specified Based on the Component
Step: 4 – Reballing Utilizes High-accuracy Assembly Tooling for Ball Placement
Step: 5 – Reflow Solder Profiles Customized for Each Component
Step: 6 – Post Ball Attach Cleaning Procedures are Monitored and Measured Using an Ionograph
Step: 7 – Part Marking Available per Customer Specifications on Request
Step: 8 – True Position, Co-planarity and Flatness are Measured Using Nikon Nexis or RVSI Model LS6000
Step: 9 – Final inspection per QAP–Quality Assurance Plans
Step: 10 – Packaging: Either Customer Supplied, JEDEC Trays or Tape and Reel per EIA-481 with Nitrogen Purged Dry Pack Bags
IC Adapters – Why Respin When You Can Adapt!
Convert Single or Multiple Components to Virtually any IC Footprint
ISI is an industry leader in high volume IC adapter products, designing approximately 150 new adapters each year to help customers through semiconductor shortages, outages, FPGA EOL, FPGA PDN, etc. We can supply the adapter pcb/substrate only, as well as provide a complete turn-key assembly by purchasing all the required components, solder the components to the top of the adapter, and test the completed assembly.
- Adapters Solve IC Obsolescence Issues, Replace EOL FPGAs, Simplify Manufacturing Processes, and Reduce Host-PCB Cost
- Low-NRE Designs Resolve Temporary Sourcing Issues as well as Permanent Component Replacements
- ISI Can Provide the Adapter Board or the Assembled Solution Including Sourcing Components
- Apdapter Products Help Customers Avoid Costly Redesigns and Re-certifications
Tech Specs
This TTI Tech Specs video for Molex ISI BGA Reballing explains ISI offers BGA reballing that includes removing the lead-free solder balls, then attaching eutectic tin-lead solder balls or other special solder ball alloys. ISI’s reballing process is tailored to each part and has been audited and approved by several Tier 1 defense suppliers.
See video transcript below
Video Transcript
If you’re designing for military, aerospace, or other high reliability applications, then you probably cringe each time you see a change notification from your semiconductor suppliers. What will you do when they convert to lead-free packaging? You get them reballed, of course! ISI offers BGA reballing that includes removing the lead-free solder balls, then attaching eutectic tin-lead solder balls or other special solder ball alloys.
ISI’s reballing process is tailored to each part and has been audited and approved by several Tier 1 defense suppliers. It includes incoming and outgoing quality inspections, high accuracy tooling for reballing, cleaning, and optical inspection, and customer specified packaging and optional part marking. This saves you from needing to stockpile your leaded BGAs or redesign your product in response to a change to lead-free packaging.