Laird Technologies Tflex HP34 Thermal Gap Filler is a silicone-free, high-performance gap filler that consists of aligned graphite fibers that provide an alternative to messy grease gap fillers. The graphite fibers are expertly aligned to provide very high bulk thermal conductivity (34W/mK). In addition to the high bulk thermal conductivity, Tflex HP34 is uniquely designed to maintain its thermal performance within an application under increased pressure. Best performance will occur in the lower pressure range of 10psi to 30psi. The Laird Tflex HP34 Thermal Gap Filler also offers low contact resistance to the mating surfaces.
Laird Technologies Tflex HP34 Series Thermal Gap Filler
Features
- Aligned Graphite
- 34W/mK Bulk Thermal Conductivity
- Silicone-Free Formulation
- Low Contact Resistance with Mating Surfaces
- Maintains Thermal Performance Under Increased Pressure
- Environmentally-Friendly with RoHS and REACH Compliance
Applications
- Telecom/Datacom
- Wireless Infrastructure
- Routers
- Servers
- Memory Modules
- Hard Disk
- Solid-State Drives
- Consumer
- Gaming Systems
- Tablets
- Notebooks
- Smart Home Devices
- Industrial
- LED Lighting
- Automation
- Test Instrumentation
- Motion Control
- Aerospace/Military
- Power Supplies
- Controllers
- Drones
- Satellites
- Automotive
- ADAS
- Infotainment
- Powertrain/ECU