Laird Technologies Tflex HD90000 Series Thermal Gap Fillers
Laird Technologies Tflex HD90000 Series Thermal Gap Fillers utilize a ceramic-filled silicone matrix to maintain consistent thermal conduction while effectively filling uneven gaps between components. These gap fillers exhibit low pressure versus deflection behavior and effective surface wetting that reduces interface resistance. The HD90000 series minimizes mechanical stress and provides low outgassing performance while adhering to regulatory standards such as RoHS and REACH. These devices offer a thermal conductivity of 7.5W/mK, an operating temperature range from -65°C to +125°C, and available thicknesses from 0.020" (500 µm) to 0.200" (5000 µm). Typical applications include automotive ADAS, drones, satellites, gaming systems, and smart home devices.
Features
- Ceramic-filled silicone sheet construction
- Grey color
- Low mechanical stress
- Low outgassing
- Low pressure versus deflection characteristics
- Low thermal resistance
- RoHS and REACH compliant
- UL 94 V-0 flammability rating
- Wide operating temperature range
Applications
- Automotive ADAS
- Automotive electronics
- Automotive infotainment
- Automotive powertrain and ECUs
- Drones and satellites
- Gaming systems
- Instrumentation
- Notebooks, tablets, and portable devices
- Routers
- Smart home devices
- Wireless infrastructure
Technical Specifications
| Parameters | Values |
|---|---|
| Thermal conductivity | 7.5W/mK |
| Operating temperature range | -65°C to +125°C |
| Thickness range | 0.020” to 0.20” |
| Density | 3.5g/cc |
| Dielectric constant | 8.14 |
