Laird Technologies Tflex HR400 Series Thermal Gap Fillers
Laird Technologies Tflex HR400 Series Thermal Gap Fillers provide a cost-effective and compliant solution for the thermal interface, delivering excellent thermal performance with easy handling. The Tflex HR400 thermal gap fillers feature a low-modulus interface pad that conforms to component topography, resulting in little stress on the components, mating chassis, or parts. These thermal gap fillers have a thermal conductivity of 1.8W/mK and a dielectric constant of 4.8. Tflex HR400 thermal gap fillers are ideal for various applications, including automotive electronics, electronics cooling, industrial electronics, and telecommunications equipment.
Features
- Inherently tacky for adhesion during assembly and transport
- Meets the UL 94V0 flame rating standard
- Outstanding thermal performance and exceptional ease of handling
- RoHS and REACH compliant
- Softness minimizes mechanical stress, absorbs shocks, and enhances device reliability
- The low modulus pad conforms to component topography, minimizing stress on parts
Applications
- Aerospace and defense
- Automotive electronics
- Industrial electronics
- LED lighting
- Medical devices
- Renewable energy systems
Technical Specifications
| Parameters | Values |
|---|---|
| Thermal conductivity | 1.8W/mK |
| Dielectric constant | 4.8 |
| Color | Grey |
| Density | 1.90g/cc |
| Operating temperature range | -50°C to +160°C |
