Laird Technologies Tflex HD7.5 Series Thermal Gap Fillers

Laird Technologies Tflex HD7.5 Series Thermal Gap Fillers provide a balance between thermal conductivity and mechanical compliance. These materials are designed to conform to irregular surfaces, ensuring efficient heat transfer. The Tflex HD7.5 series features a thermal conductivity range from 7.5W/mK to 7.8W/mK and a low compression force for reduced mechanical stress. These devices come with a density of 3.4g/cc and an operating temperature range from -40°C to +150°C. Applications include electronics, telecommunications, automotive systems, and industrial equipment where efficient heat dissipation is required.

Features

• Adheres well to surfaces without additional adhesives
• Can be easily cut or shaped to fit custom designs
• Compatible with a variety of electronic and industrial components
• Exhibits stable performance over long-term
• Facilitates improved thermal management
• Offers low thermal resistance
• Reduces interface resistance
• Supports reworkability without significant material degradation

Applications

• Automotive electronics
• Consumer electronics
• Data centers
• Industrial equipment
• LED lighting
• Medical devices
• Power electronics
• Telecommunications

Technical Specifications