Laird Technologies Tflex 600 Series Thermal Gap Fillers
Laird Technologies Tflex 600 Series Thermal Gap Fillers are soft, compliant interface pads that provide efficient heat transfer. These gap fillers use a boron nitride-filled silicone elastomer with a thermal conductivity of 3W/mK. The Tflex 600 series gap fillers come with a density of 1.34g/cc and a tensile strength of 15psi. These devices feature an operating temperature range from -45°C to +200°C and meet the UL 94 V0 flammability rating. Applications include cooling components, mass storage drives, memory modules, engine control units, and telecommunications hardware.
Features
- Available in multiple thicknesses and sheet dimensions
- Electrically insulating for safe application
- Fiberglass reinforcement in thinner variants
- Functions across a wide operating temperature range
- High flexibility to minimize stress on components
- Low outgassing emissions for sensitive environments
- Meets industry flammability safety standards
- Naturally tacky on both sides, with an option for one tacky side
- Provides efficient heat dissipation for cooling applications
Applications
- Automotive engine control units
- Cooling components to the chassis or frame
- Heat pipe thermal solutions
- High-speed mass storage drives
- RDRAM memory modules
- Telecommunications hardware
Technical Specifications
| Parameters | Values |
|---|---|
| Thermal conductivity | 3W/mK |
| Density | 1.34g/cc |
| Operating temperature range | -45°C to +200°C |
| Volume resistivity | 2×10¹³Ω-cm |
| Tensile strength | 15psi |
| Thickness tolerance | ±10% |
