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Laird Technologies BMI Grounding Contacts

Laird Technologies BMI Grounding Contacts are designed to ground, carry current and signals and interconnect boards and devices. These contacts are available in a wide variety of plating options that allow for the maximum electrical current-carrying performance. The contacts have an array of designs in a standard format that is ready for production and has lower installation costs with tape and reel packaging. BMI grounding contacts find applications in automotive, telecom, and consumer industries.

Features

Low compression force
Simple board-level Electromagnetic Capabilities (EMC) solutions for multiple grounding points
SMD contacts are RoHS compliant
Standard packaging, tape, and reel
Standard surface gold over nickel, other options available
Variety of shapes and sizes

Applications

5G
Automotive
Commercial telecom
Computing
Gaming
Handset
Industrial electronics

Technical Specifications

Parameters	Values
Storage temperature range	10°C to 25°C
Moisture sensitivity level	1
Shelf life	Typical 12 months
Mounting Type	SMT
Material	CuBe
Plating	Au