Laird Technologies’ EcoFoam offers an innovative approach to traditional shielding and grounding by providing X, Y and Z-axis conductivity, enhancing the shielding effectiveness required to meet the increasing microprocessor speeds of today’s computer, telecommunications and other electronic equipment. The product is offered with a conductive PSA tape on one side. EcoFoam can be customized to your application by die-cutting, hole-punching, notching, and so on and is especially useful for odd-shaped applications which are difficult to shield with typical profile gaskets. EcoFoam™ is designed for low-cycling applications such as input/output (I/O) shielding and other non-shear standard connectors.
Laird Technologies FR Ecofoam Flame Retardant Conductive Foam Gasket
Features
- RoHS compliant
- Halogen-free per IEC-61249-2-21 standard
- Excellent z-axis conductivity to provide effective EMI shielding and grounding
- Low compression forces allow for use of lighter materials
- Available with or without conductive PSA
- UL94V0 Flammability Rating
Applications
- 5G Data Infrastructure
- 5G Telecom
- Automotive
- Computing
- Consumer
- Datacom
- Gaming
- Handset
- Industrial Electronics
- Mobile Devices
- Printers