Aptiv Board-to Board Interconnects includes compact battery devices, connectors and holders, FPC/ZIF (flexible printed circuits/zero insertion force), I/O (input/output) connections, LIF (low insertion force), PCB (printed circuit board) interconnects, SMT (surface mount technology). These interconnects offer compact design for high density applications. The Aptiv Board-to Board Interconnects are avilable in various sizes incorporating single and multiple rows. These interconnects are used in perpendicular and stacked printed circuit boards.
Aptiv Board-to-Board Interconnects
Features
- Compact design for high density applications
- Compact hermaphroditic designs available
- Competitive industry standard design
- Variety of plating materials available for improved reliability
- Various sizes incorporating single and multiple rows
Applications
- High density connections providing interconnectivity for stacked or perpendicular printed circuit boards