Amphenol FCI DensiShield I/O System consists of high-speed cable assemblies and connectors. The system is designed to support the transmission of high-speed, serial differential signals and offers high density, mechanical robustness, excellent shielding, and signal integrity performance. These connectors are designed around a wafer system that uses a differential pair construction, making each pair shielded from the adjacent pair and the adjacent wafer. DensiShield I/O system finds application in communications, data, industrial, medical, and test equipment.
Amphenol FCI DensiShield I/O System
Features
- 4 bi-directional channels working at >2.5Gb/s
- 8-pair connectors can be mounted side by side on a 12.5mm pitch enabling multiple I/O ports along a card edge
- Connects EMC shield to chassis panel and provides shielding to PCB level
- Crimp ferrule system reliably terminates EMC shield of cable to connector covers
- Dual-beam contact system provides redundancy and long-term reliability
- Low crosstalk between differential pairs with controlled 100Ω impedance to match 100Ω shielded pair cable
- Low vertical profile allows use in systems having 15mm pitch card slot spacing
- Robust strain relief with a short cable exit enables close spacing between the chassis panel and cabinet door or wall
- RoHS compliant
- Signal ground is isolated from EMC ground
- SMT reflow-compatible PCB connector
Applications
- Communications:
- Base station
- Routers
- Servers
- Storage systems
- Switches
- Base station
- Industrial
- Medical
- Test equipment