Amphenol FCI (ACS) ExaMax High Speed Backplane Connector
Amphenol Communications Solutions ExaMax High Speed Backplane Connector is for high bandwidth applications at speeds from 25Gb/s to 56Gb/s. This backplane connector has low crosstalk noise and low insertion loss with strong signal integrity. The ExaMax has a 12 to 96 differential pair node with zero skew. The ExaMax backplane connector has copper alloy contacts, tin over nickel on press-fit tails for plating, and thermoplastic UL94-V0 housing.
Features
- 2mm and 3mm pitch
- Backwards mating and footprint
- Hermaphroditic mating interface
- Optimizes PCB routing, electrical performance, and aspect ratio
- Telcordia GR-1217-CORE Central Office qualification
- UL E66906
- Wide variety of packaging options
Applications
- Emulation Equipment
- External Storage System
- Hubs
- Industrial & Instrumentation
- Optical Transport
- Routers
- Servers
- Supercomputers
- Switches
- Test Equipment
Technical Specifications
| Parameters | Values |
|---|---|
| Nominal Impedance | 92Ω |
| Contact Resistance | 20mV maximum, 100mA current |
| Insulation Resistance | 500VDC |
| Dielectric Withstanding Voltage | 500VDC |
| Current Rating (with 30° C T-rise above ambient) | Signal Contact: 0.5A/Contact (both signal and ground contacts can carry current) |
| Operating Temperature Range | -55°C to +85°C |
| Maximum Mating Force | 0.38N per contact |
| Minimum Unmating Force | 0.10N per contact |
