Amphenol FCI Cool Express Link Connectors
Amphenol FCI Cool Express Link EDSFF E3 1C and 2C Orthogonal Cable Connectors use a die-cast orthogonal press-fit cage to support PCIe Gen 5 and Gen 6 data transmission. These hybrid connectors route power, sideband, and high-speed signals through a single midplane interface, enabling low-latency, high-bandwidth links. The simple locking and latching mechanism ensures straightforward cable insertion and removal without brackets. These devices feature a die-cast cage with hybrid signal and power contacts. The Cool Express Link connectors are used in AI/ML, high-performance computing, enterprise storage, and CXL 3.1 coherent memory-sharing systems.
Features
- 1C and 2C EDSFF form factor support
- Cable exit without external bracket
- Die-cast one-piece cage construction
- Dual-function signal and power contact design
- Expansion capability to E3 4C configurations
- High-speed PCIe Gen 5 and Gen 6 support
- Hybrid orthogonal interface (signal, power, sideband)
- Low-profile, midplane interface
- Press-fit termination for board-side connection
- Secure latching for tool-less cable retention
Applications
- AI and machine learning systems
- CXL 3.1 memory-sharing platforms
- Data center infrastructure
- Enterprise storage arrays
- High-performance computing systems
- Server backplanes and midplanes
Technical Specifications
| Parameters | Values |
|---|---|
| Form Factors Supported | EDSFF E3 1C, E3 2C |
| Data Rate Support | PCIe Gen 5 (32GT/s), Gen 6 (64GT/s) |
| Number of Signal Pins | 56 and 84 |
| Contact Material | Copper Alloy |
| Contact Plating | Tin |