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Amphenol FCI (ACS) PCIe Gen 6 Backplane Interconnect System

Amphenol PCIe Gen 6 Backplane Interconnect System is a high-density, performance backplane interconnect system that ensures reliable assembly and long-term durability. These devices provide next-generation high-speed links with excellent signal integrity through a robust ground structure surrounding each differential pair. The PCIe Gen 6 system are engineered to meet mechanical requirements, with an operating temperature range of -40°C to +85°C and an impedance of 85Ω. These components were built with proven press-fit technology, featuring a maximum rated voltage of 30VAC and a dielectric withstanding voltage of 500VAC. Typical applications include servers, storage, and supercomputers.

Features

Beam-on-blade contact design
Die-cast guide module
Ground structure on all four sides
Highest density backplane design
Modular, scalable architecture
Proven press-fit technology

Applications

Servers
Storage
Supercomputers

Technical Specifications

Parameters	Values
Operating Temperature Range	-40°C to +85°C
Impedance Rating	85Ω
Rated Signal Contact Current Rating	0.7A
Dielectric Withstanding Voltage	500VAC
Maximum Rated Voltage	30VAC