3M 3S6 Series Mini Stack Boardmount IDC Headers

3M 3S6 Series Mini Stack Boardmount Insulation-Piercing Contact (IDC) Headers provide a reliable connection with a simple, time-saving termination process while reducing the required board footprint. The compact form factor allows for 30% more board space than the 3M Mini-Clamp Connectors. 3S6 series mini stack boardmount IDC headers mates with four stacked wire mount connectors in a single action. These connectors are compatible with wire gauges from 30AWG to 22AWG and offer operating temperatures ranging from -20°C to +85°C. Common applications include data centers and telecommunications.

Features

• Compact form factor allows for 30% more board space in comparison with the 3M Mini-Clamp Connectors
• Compatible with wire gauges from 30AWG to 22AWG
• Easy mating and unmating by stacking connectors to form a block-style unit
• Feature highly reliable double IDC termination, requiring no need to strip wires
• Mates with four stacked connectors in one action
• Mating wire mount connector
• Provides a reliable connection with a simple, time-saving termination process while reducing the required board footprint
• Wiring time is reduced by approximately 60% compared to crimping connectors

Applications

• Data centers
• Industrial power
• Networking
• Telecommunications

Technical Specifications