HDLP11090UFDB30P0 Smiths Interconnect / Hypertac

HDLP11090UFDB30P0

Board to Board & Mezzanine Connectors

Manufacturer:

Mfr Part:
HDLP11090UFDB30P0

TTI Part:
Not Assigned

EDA / CAD Models

Specifications

DescriptionProduct Attribute
Similar
ManufacturerSmiths Interconnect
Product CategoryBoard to Board & Mezzanine Connectors
ProductHeaders
Number of Positions90 Position
Pitch1.3 mm (0.051 in)
Number of Rows4 Row
Termination StyleSolder Pin
Mounting AngleStraight
Current Rating1 A
Voltage Rating250 V
Minimum Operating Temperature- 55 C
Maximum Operating Temperature+ 125 C
Contact PlatingGold
Contact MaterialCopper Alloy
Housing MaterialLiquid Crystal Polymer (LCP)
SeriesHDLP
Accessory TypeBoard-to-Board, Signal
Mounting StyleScrew Mount
Product TypeBoard to Board & Mezzanine Connectors
SubcategoryBoard to Board & Mezzanine Connectors

Export and Environmental Classification

AttributeDescription
RoHS CompliantCall to Verify RoHS
RoHS Exemption NumberN/A
Lead(PB) in TerminalsCall to Verify PB
REACH SVHCNo
REACH Substance NameN/A

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EDA / CAD Models

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