Upcoming Live
The Future of Factory Automation: How AMRs/AGVs and Humanoid Robotics Are Transforming Manufacturing & Logistics
Tuesday, October 13, 2026 at 11:00 a.m. EDT
Presented By:
Elena Duggar - Molex New Market Development Manager
This webinar examines two key technologies reshaping factory automation: autonomous mobile robots (AMRs)/automated guided vehicles (AGVs) and humanoid robotics. Learn how these solutions are used in manufacturing settings, how AMR and AGV architectures differ and how humanoid robots are advancing from repetitive-task systems into intelligent platforms operating in human-centered environments.
Attendees will discover how Molex solutions address key robotics design challenges, including compact architecture, reliable high-speed data transmission, rugged power and signal connectivity, harsh-environment performance and scalable assembly.
Powering Next-Generation Solid-State Transformers with TDK Technology
Wednesday, October 14, 2026 at 11:00 a.m. EDT
Presented By:
Anirban Roy - TDK Director Industrial HA and Application Engineering
Solid-state transformers are transforming power conversion through higher switching frequencies, increased power density and greater system flexibility. This webinar explores the key component technologies needed to address the electrical, thermal and safety challenges of SST designs and how TDK solutions can help engineers optimize system performance and reliability. Intended for power electronics and system engineers seeking concise, product focused guidance on designing scalable, reliable SST solutions using TDK technologies.
The "Mortar Between the Bricks" - Interconnects in Open Standards
Tuesday, October 20, 2026 at 11:00 a.m. EDT
Presented By:
Matthew Burns - Samtec Global Director Technical Marketing
In the embedded computing ecosystem, several industry standards bodies play complementary and essential roles. This webinar will provide an overview of key organizations including SGET, PICMG and VITA and examine how their standards support MCU and FPGA-based applications, high-performance computing and real-time, modular critical embedded systems.
Attendees will learn why connector definition and selection remain a crucial part of the standards development process, serving as the "mortar between the bricks" of electromechanical system architectures.
One Portfolio, Endless Applications: Reliable Position Sensing Solutions to Harsh Environment Challenges
Wednesday, October 21, 2026 at 11:00 a.m. EDT
Presented By:
Sandeep Cherukuri - Honeywell Sr. Offering Management Lead
Join us for an engaging overview of our comprehensive position sensing portfolio, designed to meet the evolving demands of industrial applications. This webinar will explore the latest sensing technologies and application-driven solutions that enable greater accuracy, reliability and system performance.
A special focus will be placed on the RTY Dual Output Position Sensor, highlighting how it fits within a broader portfolio of sensing solutions and learn how to identify the right technology for your next design challenge.
Solving the Hardware Challenges of Next-Generation Humanoid Robots
Thursday, October 22, 2026 at 2:00 a.m. EDT
Presented By:
Blake Van Thof - Murata Business Development Manager, Sensors
Amirali Haghighi - Murata Senior Sales Engineer
In this webinar, we'll explore the hardware considerations that influence the performance of humanoid robotic systems. Rather than focusing on individual components, we'll discuss the engineering decisions behind power distribution, wireless communication, sensing and signal integrity as well as how they affect the robot as a complete system. You'll leave with practical design strategies that can help simplify integration, improve reliability and reduce development risk.
Designing for the Future: 3M Interconnect & Electronics Solutions for Next-Generation Applications
Wednesday, October 28, 2026 at 11:00 a.m. EDT
Presented By:
Greg Couture - 3M Interconnect Sales and Channel Leader
Joe Petri - 3M Sales Manager for Display and Electronics Product Platforms
As electronics evolve toward greater miniaturization, higher performance and increased reliability, engineers and procurement professionals face growing pressure to source solutions that address multiple design challenges simultaneously. This webinar explores proven solutions, including interconnects, cable assemblies, EMI absorbers, Bumpon cushioning materials and polyimide tapes. Attendees will gain insight into addressing signal integrity, EMI, mechanical instability and component protection challenges, helping accelerate design decisions, reduce development risk and improve procurement efficiency.
On-Demand
Simplifying Design with Easy-to-Configure Modular Connectors Featuring Hyperboloid Contact Technology (April 2026)
Smiths Interconnect’s new optimized, versatile and high-density modular connector series is rugged, easy to configure and employs a do-it-yourself system. The connector series is based on the principle of building blocks which consists mainly of two elements: modules and frames. It's flexible, which allows the ability to mix and match modules for signal, power, coaxial, pneumatic and high-speed data contact technologies into different configurations within a single connector frame including a vast selection of hoods.
Smarter, More Reliable Data Centers with Core Infrastructure Components (December 2025)
As demand for cloud services, AI and high-performance computing becomes the norm, data centers need to be more efficient, scalable and reliable than ever. This webinar explores how leading-edge component technologies create the foundation of modern data centers— namely, power distribution, cooling and control systems.