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What’s Changed/What’s New?

  • Aggregate demand improving; 4Q finished ahead led by AI, Mil/Aero upside, moderately better Industrial and stable Auto.
  • Bookings stepping up since Oct/Nov; B2B up to ~1.1x, extending backlog coverage and supporting strong 1Q setup.
  • 2026 outlooks firming up. Some IP&E suppliers pushing MSD price increase on avg. across disti/direct tied to metals cost inflation.
  • AI demand forecast still rising; connector industry demand projected ~2x in CY26, with some projecting doubling again in CY27.

Top 3 Channel Comments:

  • Demand trends have improved since Oct and at CES, the sentiment from customers/disti was positive. We’ve seen a healthy concern from buyers around supply assurance, which is a good sign for suppliers. Buyers are a bit concerned about inflation and component price increases, but so far, they seem willing to pay. We are forecasting double-digit growth in 2026 sales.
  • Interconnect B2B improved to ~1.1x in 4Q vs ~1.0 exiting 3Q, driven by strength in bookings, which continued into early January. Our backlog coverage for 1H26 has improved significantly over the last 3-4 months, and our focus has now shifted to filling in 2H orderbook. We are optimistic, forecasting sales to grow 10-12% in 2026, including the impact of AI.
  • Nvidia and hyperscalers want to flatten the scale-out network from three-tier to two-tier while expanding the scale-up domain. This could push the first layer of scale-out out of reach for AECs. This shift is expected to begin with VR and extend into Kyber.

Other Key Takeaways:

  • Demand improvement appears at least partly driven by increased customer focus on supply assurance amid signs of broader tightening across electronic components, including an uptick IP&E lead times as well as metal inflation impacting pricing.
  • TPU CY26 forecasts up again to ~68–69K racks vs ~60K prior and <40K in CY25. Estimating TPU connector TAM +90% in CY26.
  • CY26 Nvidia GB connector TAM projected ~60K racks (upside ~80K). VR volumes incremental, with shipments beginning 3Q26.
  • CY26 Trainium connector TAM estimate +55% Y/Y on rack volume growth and moderate content uplift tied to the backplane.
  • Copper expected to persist in AI NT/MT, particularly in scale-up, with active copper/CPC likely extending viability into 448G/lane era. Optics transition unlikely a cliff over next 3 yrs. CPO volume adoption potentially in ’27 for scale out; scale up likely in 2028+.
  • Auto demand stable exiting 4Q; 1Q outlook seasonal. CY26 production outlook still flattish with risks from tariffs/USMCA/memory. CY26 Auto connector sales likely up MSD supported by pricing.
  • Industrial reads moderately better with visibility improving; CY26 demand projected up MSD. Mil/Aero projected up HSD/LDD.
  • Capacitors demand strengthening driven by AI; lead times stretching; factory utilization already high. Resistor & Inductor demand also up ticking; lead times stable with supply generally available. Passive B2B strengthening to ~1.2x on average.

Early 2026 IP&E indicators remain encouraging, following a strengthening in fundamentals towards the end of 2025. Similar to prior months, AI remains the primary growth engine for the industry; however, December and early January feedback suggest the recovery is gradually broadening across other end markets. B2B ratios have improved heading into 2026 (typically 1.1x+ in our work), alongside firmer backlogs and pricing discipline, which collectively supports a more constructive near-term outlook.

Importantly, buyer’s tone appears to be shifting, with procurement behavior moving towards supply sufficiency/securing allocation, which should further reinforce fundamentals. We are also beginning to see early signs of genuine improvement in select Industrial pockets (beyond pure restocking), though a significant portion of feedback still characterizes Auto/Industrial consumption as stable. Overall, datapoints appear supportive of a more durable recovery trajectory in 2026, though we would like to see broader confirmation in underlying consumption trends.

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Dennis Reed

Dennis Reed

Dennis started in the industry in 2005 at FTN Midwest Research on the technology & semiconductor team. In 2006, he was a founding member of Cleveland Research Company and continued to develop an extensive network of technology industry professionals in the semiconductor, distribution, memory and HDD industries throughout the world. Dennis worked at KeyBanc Capital markets in New York, on teams covering Consumer Staples and Paper & Packing companies. Dennis also brings wide level of experience working in various roles with Travelers Insurance, including Market Research and various product roles supporting business unit growth in targeted end markets. 

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