TE Connectivity NanoRF Modules and Contacts

TE Connectivity's NanoRF Modules and Contacts target markets such as military electronics, C4ISR, and electronic warfare with applications in embedded computing. The NanoRF components offer a higher density RF coax module with twice the density of the VITA 67 SMPM RF modules used in VPX embedded computing applications. Half and full-size module sizes can retain up to 12 or 18+ RF contacts, with options for customizing contact count and position. The daughtercard modules are mounted to the card in the VPX Plug-In module and the backplane module into the chassis backplane.

The interface features a floating insert to pre-align RF contacts before engagement. Radial and axial contact float assures final alignment of the contacts and keeps the contacts fully engaged for excellent RF performance under harsh environments. The contact design supports frequencies up to 70GHz and is designed to terminate to standard .047" semi-rigid and flexible cables. The NanoRF products from TE reduce the weight and increase the density enabling smaller packaging.

Features

  • Small contact size with higher RF contact density enables smaller packaging.
  • Aluminum modules are available for weight reduction.
  • Blind-mateable float-mounted backplane contacts for module-to-module or box-to-box architecture
  • Multiple cable types to fit application requirements (designed for .047" coax cables)
  • Low loss and excellent isolation, optimized design for signal integrity
  • TE tested to vibration requirements per VITA 72
  • No special tooling required

Applications

  • Military Electronics
  • C4ISR
  • Electronic Warfare (EW)
  • Embedded Computing (VPX modules and Radar processing)